Research on the packaging technology of HTCC multi-layer co-fired ceramic substrate

HTCC multilayer co-fired ceramic substrate packaging technology is an advanced electronic packaging technology, which utilizes the unique properties of HTCC materials, such as high mechanical strength, high thermal conductivity, good chemical stability and high wiring density, to achieve high-performance electronic packaging.

HTCC firing temperature is usually between 1350~1650℃, mainly using aluminum oxide, aluminum nitride and other ceramic materials, ceramic materials suitable for high temperature co-fired and metallized ceramic materials, to ensure its stability and reliability in high temperature environment, choose the appropriate metallization process, such as refractory metal method, active metal method, to ensure the good connection between multi-layer co-fired ceramic substrate and other components.

HTCC multi-layer co-fired ceramic products include ceramic multi-layer substrate, ceramic packaging tube shell, ceramic heating sheet, etc., which are widely used in consumer electronics, aerospace and military, automotive electronics, LED and other fields, especially in applications that require high reliability and high power.