Suntech Semiconductor Packaging Capillaries realizes low-cost and high-performance manufacturing process
Suntech New Semiconductor Packaging Capillaries realizes low-cost and high-performance manufacturing process.
Preface: This paper introduces the manufacturing process of Suntech semiconductor packaging capillaries to realize low cost and high performance.
Key words: capillaries, high hardness, good wear resistance, stable and reliable quality, consistency, service life and coating, low cost.
Figure 1,Suntech Capillaries
1.Innovation of surface treatment technology: A protective film is formed on the surface of the capillaries by adopting appropriate coating technology to improve the wear resistance, corrosion resistance and oxidation resistance of the capillaries and prolong its service life. For example, plasma spraying technology is used to spray a layer of coating material with high hardness and good wear resistance on the surface of ceramic capillaries, which can prolong the service life of capillaries by 20%-30% compared with the previous one.
Figure 3,Suntech Capillaries long lifetime testing
2.Raw material selection and optimization: At present, the main material of ceramic capillaries is Zirconia toughened alumina, which has strong wear resistance, anti-oxidation ability, low thermal conductivity and easy to clean. High-density fine-grained alumina can provide good basic performance for capillaries. On the premise of ensuring quality, we have selected high cost-performance and stable quality alumina to reduce the cost of raw materials.
3. Improvement of molding process:
3.1 By utilizing precision molding technology, high-precision and high-efficiency molding of the capillaries has been achieved. This technology can accurately control the injection amount and injection speed of ceramic slurry, ensuring the dimensional accuracy and shape accuracy of the capillaries. Meanwhile, injection molding technology can achieve large volume production, improve production efficiency, and reduce production costs.
3.2 Suntech capillaries sintering process temperature has been accurate to 5℃, and the holding time error is less than 10 minutes, which ensures the consistency of product quality.
4.The processing technology, equipment optimization.
4.1 Precision machining equipment capability- the use of high-precision machining equipment after the formation of the ceramic capillaries to improve its dimensional accuracy and surface quality. Currently there is product development, design, assembly, debugging, equipment maintenance technical team. The CCD automatic measurement software is also developed by the company. We have achieved complete life cycle management of the equipment.
4.2 Precision machining skill capability - Suntech has nearly 20 years of ceramic machining experience. Through experiments and data analysis, the parameters in the machining process are optimized, the machining efficiency is improved, the machining cost is reduced, and the machining yield is also improved. At present, the first pass yield of the traditional standard capillaries can reach around 90%.
Figure 2,Suntech fully automatic machining equipment and inspection equipment
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