Advanced Ceramic Material Expert
-
Ceramic package:According to the demands of customers,printing the circuit on the Al₂O₃/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is formed.(HTCC)
Application area:
1. Infrared sensors, high-frequency high-power circuits, large-scale integrated circuits, RF devices, image sensors
2. Power devices, optical communication, lasers, microwave devices
Contact Us
Product
Suntech Advanced Ceramics (Shenzhen) Co.,Ltd
Application
Suntech Applied Materials (Hefei) Co.,Ltd
TEL:86-755-26584521
EML:info@esuntech.com
ADD:303B, Block A1, Fuyong Zhihuiyuan, Fuyong Community, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
TEL:86-0551-88788886
EML:info@esuntech.com
ADD:No.11 Huashan Road,Anhui Chaohu Economic Development Zone,Hefei, Anhui,China