Al₂O₃/AIN ceramic package


Long-term supplier of semiconductor equipment parts abroad, stable and consistent quality control.




  • Al₂O₃/AIN ceramic package:According to the demands of customers,printing the circuit on the Al₂O₃/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is formed.(HTCC)

Technology parameter:

      1、Coating thickness(Ni,Au)according to the demands of customers

      2、Advantages of gas tightness:GJB 2440A-2006(He test)


Application area:

      Bonding of semiconductors,involving wireless communication, military, medical, industrial and  other fields.