Introduction of Wedge Capillary for Wire Bonding

Introduction of Wedge Capillary for Wire Bonding

Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding according to the shape of the welded solder joints.

Wedge capillary is an important tool for wire bonding. It can be made of tungsten carbide (hard alloy), titanium carbide and ceramic.

The head of the wedge capillary is wedge. There is a through-hole on the back of wedge capillary for passing the bonding wire, and the hole diameter is related to the wire diameter. The head of wedge capillary can be made into various structures according to the packaging requirements, which determines the size and appearance of the solder joint.

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The structure of the wedge capillary determines the bonding quality. The factors such as pad size, pad spacing, welding depth, lead diameter, material, and wire hardness need to be comprehensively considered for determining the structure of the wedge capillary. The following are schematic diagrams of wedge capillary:

1. Head of wedge capillary

Head of wedge capillary

2. Shape structure of wedge capillary

                                  Collision                  Solution                Collision                 Solution

3. Solder joint of wedge capillary

4. Wedge capillary of Suntech

5. S1 Pocket type of wedge capillary

6. S2 V-notch type of wedge capillary

This article gives out an overview of the material, structure and type of wedge capillary. Suntech is specialized in manufacturing wedge and ceramic capillaries, spark rod, tungsten nozzle, spring nozzle, dispensing nozzles and other semiconductor consumable products. We have years of experience selling ceramic and metal precision parts to the semiconductor industry to meet customers' multi-link and diversified needs. We develop our products by researching related processing technologies and core technologies, developing key production links and automated intelligent production systems and coordinating application technologies in the semiconductor field and customer resources.