Alumina Ceramic Substrate
Ceramic substrates are the future of the power electronics industry, mainly due to the fact that utilization of ceramic substrates is part of ultimate solution to the increasingly serious heat dissipation and hermetic sealing problems of polymeric packaging materials.
Ceramic substrate materials mainly include alumina, beryllium oxide, aluminum nitride and silicon nitride. Among them, alumina is found wide applications for most thin-film ceramic substrates. Alumina is of high strength and hardness, wear and corrosion resistance and temperature stability and low cost. It meets requirements of insulating materials posed for the electrical & electronics devices used in the fields of LED lighting, high-power modules, refrigeration systems, automotive electronics, etc.
Alumina substrate for electronic packaging is a matured technology. The key manufacturing process includes slurry preparation, tape-casting, cutting or punching, lamination, sintering and surface grinding technology.
Suntech advanced ceramics is a provider of various types of alumina ceramic substrate.
Specification
|
|
Thickness tolerance |
|||
|
Thickness |
As-fired “standard” |
As-fired “select” |
Lapped |
Polished |
|
0.015"(0.381mm) |
±0.015"(0.381mm) |
±0.00075"(0.01905mm) |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.020"(0.508mm) |
±0.0020"(0.0508mm) |
±0.001"(0.0254mm) |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.025"(0.635mm) |
±0.0025"(0.0635mm) |
±0.00125"(0.03175mm) |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.030"(0.762mm) |
±0.003"(0.0762mm) |
±0.0015"(0.03175mm) |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.035"(0.889mm) |
±0.0035"(0.0889mm) |
±0.00175"(0.04445mm) |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.040"(1.016mm) |
±0.0040"(0.1016mm) |
/ |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.050"(1.270mm) |
±0.0050"(0.2170mm) |
/ |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
|
0.060"(1.270mm) |
±0.0060"(0.1270mm) |
/ |
±0.001"(0.0254mm) |
±0.0005"(0.0127mm) |
